CEO C.C. Wei said last week that TSMC is unable to fulfill customer demand driven by the AI boom and plans to roughly double its capacity for advanced packaging – which involves placing multiple chips into a single device, lowering the added cost of more powerful computing.
For advanced packaging, especially TSMC’s chip on wafer on substrate (CoWoS), capacity is “very tight,” Wei said after the company reported a 23% fall in second-quarter profit. “We are increasing our capacity as quickly as possible. We expect this tightening will be released next year, probably towards the end of next year.”
Even as the leading Apple supplier ramps up its expansion abroad, it plans to keep its most advanced chip technology in Taiwan, a global powerhouse in manufacturing semiconductors that power everything from smartphones to electric vehicles.