The competition between Samsung and TSMC , one of the world's leading semiconductor manufacturers, is increasing day by day. In this context, we see that both companies have made new strategic decisions. Now Samsung Foundry has transferred a former TSMC employee , Lin Jun-cheng , to head the Advanced Packaging Team .
Competition between Samsung and TSMC heats up
Reportedly, Jun-cheng, who played an important role in the development of 3D packaging technology in his 19-year TSMC career, currently sits in the executive chair of semiconductor equipment company Skytech . In addition, before TSMC, the authorized name also made significant breakthroughs in the US-based semi-auto giant Micron.
Today, 3D silicon stacking and advanced packaging technologies are seen as the beginning of a new era at the chip and system level. However, Jun-cheng will focus on the development of advanced packaging technology behind Samsung's high-performance chipsets.
Samsung's new decision comes after the company lost many of its customers to T SMC . For those who don't know, Apple has turned to TSMC for its next-generation M3 and A17 processors compared to Samsung's advanced 3nm technology. In addition, Qualcomm's new mid-range processor Snapdragon 7+ Gen 1 will also be signed by TSMC instead of Samsung.